News
|
Design and reuse an impossible dream, panelists question
A panel session at the IP-ESC 2009 Conference this week in Grenoble, France, examined IP design and reuse from a business and technology perspective and urged IP and SoC providers to reach compromises.
Seven hard lessons on writing a grant proposal
What I learned in my ten-day marathon applying for an economic stimulus grant for smart grid training.
Analog Devices' CEO:'Our enemy is us'
Leading analog chip vendors have all recently come out with "better than expected" quarterly results. Analog Devices CEO Jerry Fishman talked to EE Times of the market, the company's recent reorganization and what it takes to navigate the company in a global recession.
Updated: Intel revamps teraflop MPU efforts
Intel Corp. has re-positioned tera-scale processor R&D efforts and is moving towards a more mainstream multicore design.
China blamed for decline in base station sales
The market for cellular infrastructure gear declined 10 percent in the third quarter to $9 billion due in large part to fewer 3G deployments in China, according to a new report from market watcher Dell'Oro Group.
Cray studies exascale computing in Europe
Cray Inc. has announced three European partners for a new program aimed at delivering by the end of the decade a supercomputer capable of performing an exaflop, a quintillion calculations per second.
ISSCC preview: Sensors make all the difference
Sensor technologies and sensor circuit developments are taking front and center seat at next February's International Solid State Circuits Conference. Much of the discussion will center around MEMS sensors.
2009 Salary Survey: Engineers take a bad year in stride
Despite the toll of the past year on the economy in general and tech in particular, most EEs still love their jobs, wish to stay in the field and do not regret their investments in the profession.
picoChip to drive femtocell market: secures $20 million
picoChip has unveiled its roadmap to include complete femtocell solutions, integrating PHY, stack and femtocell system software in a end-to-end femtocell reference solution.
Intel invests $25 million in seven companies
Intel Capital has invested a total approximately $25 million in seven companies ranging from developing cloud computing infrastructure to enabling Chinese web portals.
After design loss in Sony TV, what's next for Amimon?
Betting its survival, Amimon, a developer of WHDI technology running at 5 GHz, is making dramatic changes in its product focus.
Infineon takes ARM inside security chips
Infineon Technologies AG has signed a licence agreement with microprocessor IP vendor ARM. The Munich-based chip maker plans to use the ARM architecture in a new family of high-security chip cards aimed at multimedia applications.
ARM, Aricent jump on Android bandwagon
In separate moves, ARM Ltd. has launched a new Web site and contract design company Aricent Inc. has announced a new development team both dedicated to helping engineers design systems with Google Android in further indications of the intense interest in Android and the challenges using it.
Internet re-evolution: collaborative design
Some 15 years after the Web became a household word, the Internet as a medium for collaborative design work is yet to be tested.
Slideshow: Highlights from Intel Developer Forum
This year's Intel Developer Forum will not be remembered for huge surprises or landmark announcements. But it had some visual moments.
About the DSP DesignLine News Section
DSP DesignLine's news section provides breaking news for engineers designing DSP systems including wireless handsets and base stations, portable media players and other consumer electronics, VoIP, IPTV, audio and video, and motor control.
Resource Links
|
|
|
|
